Sireda Technology Co.,Limited

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bga153(emmc) reball kit_11.5x13mm, bga reballing station
Specification: 705-0000086
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA153, size: 11.5X13mm 4.The unique tin ball storage room design, no need...

bga153(emmc) reball kit_10x11mm, bga reballing station
Specification: 705-0000167
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA153, size: 10X11mm 4.The unique tin ball storage room design, no need t...

bga162(emcp) reball kit_11.5x13mm, bga reballing station
Specification: 705-0000298
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA153, size: 11.5X13mm 4.The unique tin ball storage room design, no need...

bga221 reball kit_11.5x13mm, bga reballing station
Specification: 705-0000340
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA 221, size: 11.5X13mm 4.The unique tin ball storage room design, no nee...

bga169(emmc) reball kit_12x16mm, bga reballing station
Specification: 705-0000493
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 12X16mm 4.The unique tin ball storage room design, no need t...

bga169(emmc) reball kit_12x18mm, bga reballing station
Specification: 705-0000494
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 12X18mm 4.The unique tin ball storage room design, no need t...

bga169(emmc) reball kit_14x18mm, bga reballing station
Specification: 705-0000495
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positionin 3.Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 14X18mm 4.The unique tin ball storage room design, no need to ...

bga162(emcp) reball kit_12x13.5mm, bga reballing station
Specification: 705-0000496
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA162, size: 12X13.5mm 4.The unique tin ball storage room design, no need...

bga186(emcp) reball kit_12x16mm, bga reballing station
Specification: 705-0000497
Detail: 1.Aluminum alloy structure, lightweight and durable structure 2.Precision IC guide, accurate positioning. 3.Steel Dimensions: (80 x 80) mm, apply to BGA186, size: 12X16mm 4.The unique tin ball storage room design, no need t...

bga169 socket_12x16mm_perform, emmc adapter
Specification: 702-0000075
Detail: <1>Test, debug, validation, and programming of eMMC, eMCP devices <2>Failure analysis / System and wafer test <3>Package and Chip qualification Feature: <1>Change the sliding friction to rolling friction for the latch, Ke...


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