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Build Your Online Product Catalogs?
| Product Name: |
BGA162(eMCP) Reball Kit_11.5X13mm, BGA Reballing Station
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| Supply Ability: |
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| Related proudcts |
reball kit, reball station, bga reball kit, |
| Specifications |
705-0000298 |
| Price Term: |
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| Port of loading: |
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| Minimum Order |
1 |
| Unit Price: |
169 |
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1.Aluminum alloy structure, lightweight and durable structure
2.Precision IC guide, accurate positioning.
3.Steel Dimensions: (80 x 80) mm, apply to BGA153, size: 11.5X13mm
4.The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.
5.For more other BGA Reballing Kit, please contact our sales man.
6.Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranted. |
| Company: |
Sireda Technology Co.,Limited
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| Contact: |
Ms. vicky yuan |
| Address: |
A Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, |
| Postcode: |
518132 |
| Tel: |
86755-23066306 ext 8045 |
| Fax: |
0755-36697974 |
| E-mail: |
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